Patent · US Active

Cut inside replacement metal gate trench to mitigate N-P proximity effect

US10658363B2 · kind B2 · utility

0Cited by
17References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 6, 2019
Grant dateMay 19, 2020
Priority date
Expiry dateSep 6, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D64/691
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present disclosure relates to semiconductor structures and, more particularly, to a cut inside a replacement metal gate trench to mitigate n-p proximity effects and methods of manufacture. The structure described herein includes: a first device; a second device, adjacent to the first device; a dielectric material, of the first device and the second device, including a cut within a trench between the first device and the second device; and a common gate electrode shared with the first device and the second device, the common gate electrode provided over the dielectric material and contacting underlying material within the cut.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.