Patent · US Active

Method of examining locations in a wafer with adjustable navigation accuracy and system thereof

US10663407B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

Applied Materials Israel Ltd. · IL

Inventors

Idan Kaizerman · Meitar, IL
Mark Geshel · Kfar Sava, IL

Key dates

Filing date	Dec 20, 2018
Grant date	May 26, 2020
Priority date	—
Expiry date	Dec 20, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/12
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Data indicative of alignment targets may be received. Each alignment target may be associated with a target location on an object. Locations of the object to be inspected may be identified. An alignment target from the alignment targets may be selected. Each of the locations may be within a determined distance from the selected alignment target. An indication may be provided to align the object relative to an examination tool for inspecting the locations within the determined distance from the selected alignment target.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.