Low force wafer test probe with variable geometry

US10663487B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• David M. Audette · Webster, US
• Dennis R. Conti · South Burlington, US
• Marc D. Knox · Mechanicsville, US
• Grant Wagner · Jericho, US

Key dates

• Filing date: Feb 28, 2019
• Grant date: May 26, 2020
• Expiry date: Feb 28, 2039

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2886
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A system for testing functionality of die on a wafer including a plurality of contacts includes a support structure and a plurality of probes mounted to the support structure in an array. A configuration of each of the plurality of probes varies based on a position of the probe within the array to maintain uniform engagement between the plurality of probes and a corresponding plurality of contacts across the array.