Automated apparatus to temporarily attach substrates to carriers without adhesives for processing
US10665494B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2018 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Jan 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments include a method for processing thin substrates. Embodiments may include electrostatically bonding a substrate to a first electrostatic carrier (ESC), with a backside of the substrate is facing away from the first ESC. Thereafter, the substrate may be thinned to form a thinned substrate. The thinned substrate may then be transferred to a second ESC with a front side of the thinned substrate facing away from the second ESC. Embodiments may include cleaning the front side surface of the thinned substrate and transferring the thinned substrate to a third ESC. In an embodiment, a backside of the thinned substrate is facing away from the third ESC. Embodiments may also include processing the backside surface of the thinned substrate, and transferring the thinned substrate to a tape frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.