Connections between laminated heater and heater voltage inputs
US10667379B2 · kind B2 · utility
0Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2017 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Apr 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/037
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, a heating layer arranged on the baseplate, a ceramic layer arranged on the heating layer, and wiring provided through the baseplate, the heating layer, and into the ceramic layer in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the first zone, across the ceramic layer to a second zone of the plurality of heating zones, and to a heating element in the heating layer in the second zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.