Patent · US Active

Integrated circuit substrate and method for manufacturing the same

US10672716B2 · kind B2 · utility

0Cited by

12References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Roesner · Villach, AT
Gudrun Stranzl · Eisenlohrsweg, AT
Manfred Engelhardt · Feldkirchen-Westerham, DE
Martin Zgaga · Rosegg, AT

Key dates

Filing date	Jul 9, 2018
Grant date	Jun 2, 2020
Priority date	—
Expiry date	Jul 9, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2223/54473
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit substrate and a method for manufacturing the same are disclosed. In an embodiment a method includes providing a wafer having a plurality of active areas, each active area being provided in a separate die area and for each active area, providing a code pattern outside the active area, the code pattern being associated with the die area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.