Ceramic heater with enhanced RF power delivery
US10692703B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2017 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Jul 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32715
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure generally relate to a substrate support assembly in a semiconductor processing chamber. The semiconductor processing chamber may be a PECVD chamber including a substrate support assembly having a substrate support and a stem coupled to the substrate support. An RF electrode is embedded in the substrate support and a rod is coupled to the RF electrode. The rod is made of titanium (Ti) or of nickel (Ni) coated with gold (Au), silver (Ag), aluminum (Al), or copper (Cu). The rod made of Ti or of Ni coated with Au, Ag, Al or Cu has a reduced electrical resistivity and increased skin depth, which minimizes heat generation as RF current travels through the rod.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.