Methods and apparatus for reducing sputtering of a grounded shield in a process chamber
US10692706B2 · kind B2 · utility
3Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2013 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Apr 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3411
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for physical vapor deposition are provided herein. In some embodiments, a process kit shield for use in a physical vapor deposition chamber may include an electrically conductive body having one or more sidewalls defining a central opening, wherein the body has a ratio of a surface area of inner facing surfaces of the one or more sidewalls to a height of the one or more sidewalls of about 2 to about 3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.