Identifying nuisances and defects of interest in defects detected on a wafer

US10699926B2 · kind B2 · utility

Assignee

• KLA-TENCOR CORPORATION · US

Inventors

• Martin Plihal · Pleasanton, US
• Brian Duffy · San Jose, US
• Mike VonDenHoff · Munich, DE
• Andrew Cross · Hale, GB
• Kaushik Sah · Milpitas, US
• Antonio Mani · Leuven, BE

Key dates

• Filing date: Aug 27, 2018
• Grant date: Jun 30, 2020
• Expiry date: Sep 6, 2038

Classification

• Technology area (CPC G): Physics
• CPC primary: G06T2207/30148
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Methods and systems fir identifying nuisances and defects of interest (DOIs) in defects detected on a wafer are provided. One method includes acquiring metrology data for the wafer generated by a metrology tool that performs measurements on the wafer at an array of measurement points. In one embodiment, the measurement points are determined prior to detecting the defects on the wafer and independently of the defects detected on the wafer. The method also includes determining locations of defects detected on the wafer with respect to locations of the measurement points on the wafer and assigning metrology data to the defects as a defect attribute based on the locations of the defects determined with respect to the locations of the measurement points. In addition, the method includes determining if the defects are nuisances or DOIs based on the defect attributes assigned to the defects.