Deposition and treatment of films for patterning
US10699952B2 · kind B2 · utility
0Cited by
32References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2019 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Apr 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/266
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods comprising depositing a film material to form an initial film in a trench in a substrate surface are described. The film is treated to expand the film to grow beyond the substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.