Process kit design for in-chamber heater and wafer rotating mechanism

US10704147B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Muhammad M. Rasheed · San Jose, US
• Muhannad Mustafa · Milpitas, US
• Hamid Tavassoli · Cupertino, US
• Steven V. Sansoni · Livermore, US
• Cheng-Hsiung Tsai · Cupertino, US
• Vikash Banthia · Los Altos, US

Key dates

• Filing date: Feb 1, 2017
• Grant date: Jul 7, 2020
• Expiry date: Jan 8, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6831
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the present disclosure are directed process kits for use with an in-chamber heater and substrate rotating mechanism. In some embodiments consistent with the present disclosure, a process kit for use with a rotatable substrate support heater pedestal for supporting a substrate in a process chamber may include an upper edge ring including a top ledge and a skirt the extends downward from the top ledge, a lower edge ring that at least partially supports the upper edge ring and aligns the upper edge ring with the substrate support heater pedestal, a bottom plate disposed on a bottom of the process chamber that supports the upper edge ring when the substrate support heater pedestal is in a lowered non-processing position, and a shadow ring that couples with the upper edge ring when the substrate support heater pedestal is in a raised processing position.