Micromechanical structure and method for manufacturing the same

US10710874B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Tobias Frischmuth · Wien, AT
• Guenter Denifl · Annenheim, AT
• Thomas Grille · Villach, AT
• Ursula Hedenig · Villach, AT
• Markus Kahn · Rangersdorf, AT
• Daniel Maurer · Feld am See, AT
• Ulrich Schmid · Wien, AT
• Michael Schneider · Wien, AT

Key dates

• Filing date: Jun 29, 2017
• Grant date: Jul 14, 2020
• Expiry date: Oct 19, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04R2201/003
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical structure in accordance with various embodiments may include: a substrate; and a functional structure arranged at the substrate; wherein the functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region; and wherein at least a section of the functional region has an elastic modulus in the range from about 5 GPa to about 70 GPa.