Apparatus with multi-wafer based device comprising embedded active and/or passive devices and method for forming such
US10714446B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Mar 30, 2017 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Mar 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus is provided which comprises: a substrate; a first active device adjacent to the substrate; a first set of one or more layers to interconnect with the first active device; a second set of one or more layers; a second active and/or passive device coupled to the second set of one or more layers; and a layer adjacent to one of the layers of the first and second sets, wherein the layer is to bond the one of the layers of the first and second sets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.