Light pipe window structure for low pressure thermal processes

US10727093B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Paul Brillhart · Pleasanton, US
• Joseph M. Ranish · San Jose, US
• Aaron Muir Hunter · Santa Cruz, US
• Edric Tong · Sunnyvale, US
• James Francis Mack · Palo Alto, US
• Kin Pong Lo · Fremont, US
• Errol Antonio C. Sanchez · Tracy, US
• Zhiyuan Ye · San Jose, US
• Anzhong Chang · San Jose, US

Key dates

• Filing date: Mar 12, 2015
• Grant date: Jul 28, 2020
• Expiry date: Jun 5, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05B3/0047
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments disclosed herein relate to a light pipe structure for thermal processing of semiconductor substrates. In one embodiment, a light pipe window structure for use in a thermal process chamber includes a transparent plate, and a plurality of light pipe structures formed in a transparent material that is coupled to the transparent plate, each of the plurality of light pipe structures comprising a reflective surface and having a longitudinal axis disposed in a substantially perpendicular relation to a plane of the transparent plate.