System for non radial temperature control for rotating substrates
US10741457B2 · kind B2 · utility
2Cited by
23References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 29, 2017 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Nov 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention provide apparatus and method for reducing non uniformity during thermal processing. One embodiment provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to rotate the substrate, a sensor assembly configured to measure temperature of the substrate at a plurality of locations, and one or more pulse heating elements configured to provide pulsed energy towards the processing volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.