Patent · US Active

Plated through hole socketing coupled to a solder ball to engage with a pin

US10741947B2 · kind B2 · utility

1Cited by

12References

23Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Amruthavalli Pallavi Alur · Tempe, US
Siddharth K. Alur · Chandler, US
Liwei Cheng · Chandler, US
Lauren A. Link · Mesa, US
Jonathan L. Rosch · Mesa, US
Sai Vadlamani · Chandler, US
Cheng Xu · Chandler, US

Key dates

Filing date	Jan 11, 2018
Grant date	Aug 11, 2020
Priority date	—
Expiry date	Jan 11, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10265
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

An electronic interconnect may include a substrate. The substrate may include a passageway in the substrate. The passageway may extend from a first surface of the substrate toward a second surface of the substrate. The passageway may be closed at an end of the passageway. The electronic interconnect may include a plated through hole socket coupled to the passageway. The electronic interconnect may include a contact. The contact may include a pin. The pin may be configured to engage with the plated through hole socket. The electronic interconnect may include a solder ball. The solder ball may be coupled to the plated through hole socket.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.