Patent · US Active

Carrier arrangement and method for processing a carrier by generating a crack structure

US10748801B2 · kind B2 · utility

0Cited by

0References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gunther Mackh · Dresden, DE
Markus Brunnbauer · Lappersdorf, DE
Adolf Koller · Regensburg, DE
Jochen Mueller · Regensburg, DE

Key dates

Filing date	Mar 29, 2018
Grant date	Aug 18, 2020
Priority date	—
Expiry date	Mar 29, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68381
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

According to various embodiments, a method for processing a carrier may include: forming an arrangement of defects in the carrier, wherein a surface region of the carrier is disposed over the arrangement of defects at a first surface of the carrier, wherein the arrangement of defects is configured to generate a crack structure extending from the arrangement of defects into the surface region; partially removing the carrier to remove the arrangement of defects; and separating the surface region of the carrier into a plurality of surface region portions along the crack structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.