System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter

US10763142B2 · kind B2 · utility

Assignee

• Lam Research Corporation · US

Inventors

• Marcus Musselman · Oakland, US
• Juan Valdivia · Fremont, US
• Hua Xiang · Pleasanton, US
• Andrew D. Bailey, III · Pleasanton, US
• Yoko Yamaguchi · Union City, US
• Qian Fu · Pleasanton, US
• Aaron Eppler · Fremont, US

Key dates

• Filing date: Sep 21, 2015
• Grant date: Sep 1, 2020
• Expiry date: Jan 3, 2037

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P90/02
• WIPO field: Control
• WIPO sector: Instruments

Abstract

A system for controlling a condition of a wafer processing chamber is disclosed. According the principles of the present disclosure, the system includes memory and a first controller. The memory stores a plurality of profiles of respective ones of a plurality of first control elements. The plurality of first control elements are arranged throughout the chamber. The first controller determines non-uniformities in a substrate processing parameter associated with the plurality of first control elements. The substrate processing parameter is different than the condition of the chamber. The first controller adjusts at least one of the plurality of profiles based on the non-uniformities in the substrate processing parameter and a sensitivity of the substrate processing parameter to the condition.