Packaged semiconductor components having substantially rigid support members
US10763185B2 · kind B2 · utility
0Cited by
75References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2019 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Apr 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.