Lead frame
US10763196B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2020 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Mar 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame includes, as an outermost plating layer, a roughened silver plating layer having acicular projections and covering the entire surface of a lead frame substrate made of a copper-based material. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.