Encapsulated microelectromechanical structure
US10766768B2 · kind B2 · utility
0Cited by
225References
20Claims
0Family size
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Key dates
| Filing date | Sep 10, 2019 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Sep 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.