EPI thickness tuning by pulse or profile spot heating

US10770319B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Shu-Kwan LAU · Sunnyvale, US
• Zhiyuan Ye · San Jose, US
• Zuoming ZHU · Sunnyvale, US
• Nyi O. Myo · San Jose, US
• Errol Antonio C. Sanchez · Tracy, US
• Schubert S. Chu · San Francisco, US

Key dates

• Filing date: Feb 12, 2019
• Grant date: Sep 8, 2020
• Expiry date: Feb 12, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68792
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments described herein provide processing chambers that include an enclosure for a processing volume, a rotatable support within the enclosure, the support having a shaft that extends outside the enclosure, wherein the shaft has a signal feature located outside the processing volume, an energy module within the enclosure, wherein the shaft extends through the energy module, one or more directed energy sources coupled to the enclosure, and one or more signalers positioned proximate to the signal feature, each signaler coupled to at least one of the directed energy sources.