Pad structure and fabrication methods
US10773509B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2017 |
| Grant date | Sep 15, 2020 |
| Priority date | — |
| Expiry date | Oct 14, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0058
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.