Daniel Redfield
49Patents
15h-index
53Co-inventors
76Inventor score
Filing activity: Apr 22, 2014 → Sep 16, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9873180B2 | CMP pad construction with composite material properties using additive manufacturing processes | Performing Operations; Transporting | 37 | Active |
| US10384330B2 | Polishing pads produced by an additive manufacturing process | Performing Operations; Transporting | 20 | Active |
| US10456886B2 | Porous chemical mechanical polishing pads | Performing Operations; Transporting | 20 | Active |
| US9776361B2 | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles | Performing Operations; Transporting | 20 | Active |
| US10399201B2 | Advanced polishing pads having compositional gradients by use of an additive manufacturing process | Performing Operations; Transporting | 20 | Active |
| US10593574B2 | Techniques for combining CMP process tracking data with 3D printed CMP consumables | Electricity | 17 | Active |
| US10391605B2 | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process | Performing Operations; Transporting | 17 | Active |
| US10618141B2 | Apparatus for forming a polishing article that has a desired zeta potential | Electricity | 17 | Active |
| US10537974B2 | CMP pad construction with composite material properties using additive manufacturing processes | Performing Operations; Transporting | 16 | Active |
| US10875145B2 | Polishing pads produced by an additive manufacturing process | Performing Operations; Transporting | 16 | Active |
| US10821573B2 | Polishing pads produced by an additive manufacturing process | Performing Operations; Transporting | 16 | Active |
| US10919123B2 | Piezo-electric end-pointing for 3D printed CMP pads | Electricity | 15 | Active |
| US10322491B2 | Printed chemical mechanical polishing pad | Performing Operations; Transporting | 15 | Active |
| US10875153B2 | Advanced polishing pad materials and formulations | Performing Operations; Transporting | 15 | Active |
| US10773509B2 | Pad structure and fabrication methods | Performing Operations; Transporting | 15 | Active |
| US10953515B2 | Apparatus and method of forming a polishing pads by use of an additive manufacturing process | Performing Operations; Transporting | 15 | Active |
| US10493691B2 | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles | Performing Operations; Transporting | 15 | Active |
| US11745302B2 | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process | Performing Operations; Transporting | 3 | Active |
| US10882160B2 | Correction of fabricated shapes in additive manufacturing using sacrificial material | Performing Operations; Transporting | 3 | Active |
| US11724362B2 | Polishing pads produced by an additive manufacturing process | Performing Operations; Transporting | 3 | Active |
| US10589399B2 | Textured small pad for chemical mechanical polishing | Performing Operations; Transporting | 2 | Active |
| US10537973B2 | Correction of fabricated shapes in additive manufacturing | Performing Operations; Transporting | 1 | Active |
| US9832816B2 | Absorbing reflector for semiconductor processing chamber | Electricity | 1 | Active |
| US11446788B2 | Precursor formulations for polishing pads produced by an additive manufacturing process | Performing Operations; Transporting | 1 | Active |
| US11154961B2 | Correction of fabricated shapes in additive manufacturing | Performing Operations; Transporting | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.