Wafer transport assembly with integrated buffers

US10790174B2 · kind B2 · utility

Assignee

• Lam Research Corporation · US

Inventors

• John Daugherty · Fremont, US
• David Trussell · Fremont, US
• Michael C. Kellogg · Fremont, US
• Christopher Pena · Hayward, US
• Richard H. Gould · Fremont, US
• Klay Kunkel · Sunol, US

Key dates

• Filing date: Apr 12, 2018
• Grant date: Sep 29, 2020
• Expiry date: Apr 12, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67769
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.