Enhanced automatic wafer centering system and techniques for same
US10796940B2 · kind B2 · utility
4Cited by
3References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2018 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | Feb 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and techniques for determining and correcting inter-wafer misalignments in a stack of wafers transported by a wafer handling robot are discussed. An enhanced automatic wafer centering system is provided that may be used to determine a smallest circle associated with the stack of wafers, which may then be used to determine whether or not the stack of wafer meets various process requirements and/or if a centering correction can be made to better align the wafers with a receiving station coordinate frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.