Process of forming an electronic device including an access region

US10797152B2 · kind B2 · utility

Assignee

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC · US

Inventors

• Abhishek Banerjee · Houston, US
• Piet Vanmeerbeek · Sleidinge, BE
• Peter Moens · Zottegem, BE
• Marnix Tack · Merelbeke, BE

Key dates

• Filing date: Jun 4, 2018
• Grant date: Oct 6, 2020
• Expiry date: Jun 4, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D64/685
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic device can include a channel layer; an access region having an aluminum content substantially uniform or increasing with distance from the channel layer; and a gate dielectric layer overlying and contacting the channel layer. A process of forming an electronic device can include providing a substrate and a channel layer of a III-V semiconductor material over the substrate; forming a masking feature over the channel layer; and forming an access region over the channel layer. In an embodiment, the channel layer can include GaN, and the access region has an aluminum content that is substantially uniform or increases with distance from the channel layer. In another embodiment, the process can include removing at least a portion the masking feature and forming a gate dielectric layer over the channel layer. A dielectric film of the masking feature or the gate dielectric layer contacts the channel layer.