Storage node shaping

US10811419B1 · kind B1 · utility

Assignee

• Micron Technology, Inc. · US

Inventors

• Devesh Dadhich Shreeram · Boise, US
• Sanket S. Kelkar · Boise, US
• Gurpreet Lugani · Boise, US
• Paul A. Paduano · Boise, US
• Matthew N. Rocklein · Boise, US
• Sanjeev Sapra · Boise, US
• Christopher W. Petz · Boise, US

Key dates

• Filing date: May 22, 2019
• Grant date: Oct 20, 2020
• Expiry date: May 22, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D1/716

Abstract

Methods, apparatuses, and systems related to shaping a storage node material are described. An example method includes forming a pillar with a pattern of materials. The method further includes depositing a storage node material on a side of the pillar. The method further includes etching sacrificial materials within the pillar. The method further includes etching the storage node material in a direction from the pillar into the storage node.