Patent · US Active

Method for permanently bonding wafers

US10825793B2 · kind B2 · utility

0Cited by

15References

8Claims

0Family size

Assignee

EV GROUP E. THALLNER GMBH · AT

Inventors

Thomas Plach · Linz, AT
Kurt Hingerl · Steyr, AT
Markus Wimplinger · Ried im Innkreis, AT
Christoph Flotgen · Pramerdorf, AT

Key dates

Filing date	Apr 8, 2011
Grant date	Nov 3, 2020
Priority date	—
Expiry date	Apr 8, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/20106
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.