Sensor package and method
US10832985B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2019 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Feb 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.