Managing thermal warpage of a laminate
US10832987B2 · kind B2 · utility
0Cited by
7References
16Claims
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Assignee
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Key dates
| Filing date | Mar 24, 2018 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Apr 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of managing thermal warpage of a laminate which includes: assembling a stiffener and an adhesive on the laminate, the stiffener being a material that has a higher modulus of elasticity than the laminate; applying a force to deform the laminate a predetermined amount; heating the laminate, stiffener and adhesive to a predetermined temperature at which the adhesive cures to bond the stiffener to the laminate; cooling the laminate, stiffener and adhesive to a temperature below the predetermined temperature, the laminate maintaining its deformed shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.