Device for mounting semiconductor element, lead frame, and substrate for mounting semiconductor element
US10847451B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2020 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Mar 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for mounting a semiconductor element includes a metal plate serving as a base, a roughened silver plating layer with acicular projections, formed on at least either of: (a) top faces; and (b) faces that form concavities or through holes between the top faces and bottom faces; of the metal plate, and a reinforcing plating layer covering, as an outermost plating layer, an outer surface of the acicular projections in the roughened silver plating layer. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. An outer surface of the reinforcing plating layer is shaped to have acicular projections with a surface area ratio of 1.30 or more and 6.00 or less to the corresponding smooth surface, as inheriting the shape of the acicular projections in the roughened silver plating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.