Patent · US Active

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US10866523B2 · kind B2 · utility

0Cited by
4References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 27, 2016
Grant dateDec 15, 2020
Priority date
Expiry dateSep 19, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/0274
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A method for adjusting a lithography process, wherein processing parameters of the lithography process include a first group of processing parameters and a second group of processing parameters, the method including: obtaining a change of the second group of processing parameters; determining a change of a sub-process window (sub-PW) as a result of the change of the second group of processing parameters, wherein the sub-PW is spanned by only the first group of processing parameters; and adjusting the first group of processing parameters based on the change of the sub-PW.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.