Patent · US Active

Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same

US10872835B1 · kind B1 · utility

3Cited by
1References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 3, 2019
Grant dateDec 22, 2020
Priority date—
Expiry dateJul 3, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/10378
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Semiconductor assemblies including thermal management configurations for reducing heat transfer between vertically stacked devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor assemblies comprise at least one memory device mounted over a logic device with a thermally conductive layer, a thermal-insulator interposer, or a combination thereof disposed between the memory device and the logic device. The thermally conductive layer includes a structure configured to transfer the thermal energy across a horizontal plane. The thermal-insulator interposer includes a structure configured to reduce heat transfer between the logic device and the memory device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.