Using sacrificial polymer materials in semiconductor processing
US10916418B2 · kind B2 · utility
1Cited by
4References
20Claims
0Family size
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Key dates
| Filing date | Nov 7, 2019 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Nov 7, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0108
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an example, a wet cleaning process is performed to clean a structure having features and openings between the features while preventing drying of the structure. After performing the wet cleaning process, a polymer solution is deposited in the openings while continuing to prevent any drying of the structure. A sacrificial polymer material is formed in the openings from the polymer solution. The structure may be used in semiconductor devices, such as integrated circuits, memory devices, MEMS, among others.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.