Compositions and methods for selectively etching titanium nitride
US10920141B2 · kind B2 · utility
1Cited by
79References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2014 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Jun 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31144
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., cobalt, ruthenium and copper, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.