Method for detecting voids and an inspection system
US10922809B2 · kind B2 · utility
2Cited by
1References
15Claims
0Family size
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Key dates
| Filing date | Jul 31, 2018 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Mar 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for detecting voids in a metal line of a semiconductor device die includes: scanning an electron beam upon a selected location on the die containing the metal line; determine gray levels in an image produced by collected electrons of the electron beam backscattered from the selected location on the die; and identifying one or more voids in the metal line based on differences between the gray levels in the image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.