Abatement and strip process chamber in a load lock configuration
US10943788B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2019 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Oct 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Examples of the present disclosure provide a load that includes a chamber body assembly. The chamber body assembly defines a first chamber volume and a second chamber volume fluidly isolated from one another. The first chamber volume and second chamber volume are selectively connectable to two environments through two sets of openings configured for substrate transferring. A third chamber volume is selectively connectable to the two environments through two sets of openings. A remote plasma source couples a processing gas source to the second chamber volume. A cooled substrate support assembly, includes a plurality of cooling channels, bounds a portion of the first chamber volume. A heated substrate support assembly can support a substrate. A gas distribution assembly, includes a showerhead, is disposed in the second chamber volume and is coupled to the remote plasma source. The showerhead can provide a processing gas to the second chamber volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.