Jared Ahmad Lee
37Patents
7h-index
52Co-inventors
68Inventor score
Filing activity: Feb 26, 2007 → Jun 5, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7846497B2 | Method and apparatus for controlling gas flow to a processing chamber | Emerging Cross-Sectional Technologies | 23 | Active |
| US7775236B2 | Method and apparatus for controlling gas flow to a processing chamber | Emerging Cross-Sectional Technologies | 13 | Active |
| US8074677B2 | Method and apparatus for controlling gas flow to a processing chamber | Emerging Cross-Sectional Technologies | 11 | Active |
| US10090181B2 | Method and apparatus for substrate transfer and radical confinement | Electricity | 9 | Active |
| US10204805B2 | Thin heated substrate support | Electricity | 9 | Active |
| US8992689B2 | Method for removing halogen-containing residues from substrate | Electricity | 8 | Active |
| US8845816B2 | Method extending the service interval of a gas distribution plate | Emerging Cross-Sectional Technologies | 8 | Active |
| US9976211B2 | Plasma erosion resistant thin film coating for high temperature application | Chemistry; Metallurgy | 6 | Active |
| US7975558B2 | Method and apparatus for gas flow measurement | Emerging Cross-Sectional Technologies | 4 | Active |
| US10815562B2 | Plasma erosion resistant thin film coating for high temperature application | Chemistry; Metallurgy | 3 | Active |
| US11110425B2 | Gas distribution plate for thermal deposition | Performing Operations; Transporting | 2 | Active |
| US11584993B2 | Thermally uniform deposition station | Electricity | 2 | Active |
| US10566205B2 | Abatement and strip process chamber in a load lock configuration | Electricity | 2 | Active |
| US11705312B2 | Vertically adjustable plasma source | Electricity | 1 | Active |
| US11776793B2 | Plasma source with ceramic electrode plate | Electricity | 1 | Active |
| US11583816B2 | Gas distribution plate for thermal deposition | Performing Operations; Transporting | 1 | Active |
| US10276354B2 | Segmented focus ring assembly | Chemistry; Metallurgy | 1 | Active |
| US9464732B2 | Apparatus for uniform pumping within a substrate process chamber | Emerging Cross-Sectional Technologies | 1 | Active |
| US11043386B2 | Enhanced spatial ALD of metals through controlled precursor mixing | Electricity | 1 | Active |
| US11887856B2 | Enhanced spatial ALD of metals through controlled precursor mixing | Electricity | 0 | Active |
| US11479855B2 | Spatial wafer processing with improved temperature uniformity | Electricity | 0 | Active |
| US11574831B2 | Method and apparatus for substrate transfer and radical confinement | Electricity | 0 | Active |
| US10943788B2 | Abatement and strip process chamber in a load lock configuration | Electricity | 0 | Active |
| US11171008B2 | Abatement and strip process chamber in a dual load lock configuration | Emerging Cross-Sectional Technologies | 0 | Active |
| US12288677B2 | Vertically adjustable plasma source | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.