Method of cleaning substrate processing apparatus and system of cleaning substrate processing apparatus
US10950465B2 · kind B2 · utility
2Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2017 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Dec 2, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/20
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Disclosed is a method of cleaning a substrate processing apparatus in which a substrate having a surface wet by a liquid is brought into contact with a supercritical fluid so as to perform a drying process of drying the substrate. The method includes a cleaning gas filling process and an exhausting process. The cleaning gas filling process fills a cleaning gas containing isopropyl alcohol in the substrate processing apparatus. The exhausting process exhausts the cleaning gas from an inside of the substrate processing apparatus after the cleaning gas filling process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.