Method for transferring a useful layer
US10950491B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 1, 2017 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Aug 1, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A useful layer is layered onto a support by a method that includes the steps of forming an embrittlement plane by implanting light elements into a first substrate, so as to form a useful layer between such plane and one surface of the first substrate; applying the support onto the surface of the first substrate so as to form an assembly to be fractured; applying a heat treatment for embrittling the assembly to be fractured; and initiating and propagating a fracture wave into the first substrate along the embrittlement plane. The fracture wave is initiated in a central area of the embrittlement plane and the propagation speed of the wave is controlled so that the velocity thereof is sufficient to cause the interactions of the fracture wave with acoustic vibrations emitted upon the initiation and/or propagation thereof, if any, are confined to a peripheral area of the useful layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.