Process kit ring adaptor

US10964584B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Leon Volfovski · Mountain View, US
• Andreas Schmid · Duisburg, DE
• Denis M. Koosau · Sunnyvale, US
• Nicholas Michael Kopec · Santa Clara, US
• Steven E. Babayan · Los Altos, US
• Douglas R. McAllister · Pleasanton, US
• Helder Lee · San Jose, US
• Jeffrey C. Hudgens · San Francisco, US
• Damon K. Cox · Round Rock, US

Key dates

• Filing date: May 20, 2019
• Grant date: Mar 30, 2021
• Expiry date: May 20, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/677
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.