Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods

US10971381B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Michael R. Rice · Pleasanton, US
• Michael Meyers · San Jose, US
• John Mazzocco · San Jose, US
• Dean C. Hruzek · Cedar Park, US
• Michael Kuchar · Georgetown, US
• Sushant S. Koshti · Sunnyvale, US
• Penchala N. Kankanala · Santa Clara, US
• Eric A. Englhardt · Palo Alto, US

Key dates

• Filing date: Nov 3, 2014
• Grant date: Apr 6, 2021
• Expiry date: Nov 3, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67742
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.