Patent · US Active

Stair-stacked dice device in a system in package, and methods of making same

US10991679B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Zhicheng Ding · Shanghai, CN
Bin Liu · Fishers, US
Yong She · Shanghai, CN
Aiping Tan · Shanghai, CN
Li Deng · Shanghai, CN

Key dates

Filing date	Sep 3, 2020
Grant date	Apr 27, 2021
Priority date	—
Expiry date	Sep 3, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system in package includes a stair-stacked memory module that is stacked vertically with respect to a processor die. A spacer is used adjacent to the processor die to create a bridge for the stair-stacked memory module. Each memory die in the stair-stacked memory module includes a vertical bond wire that emerges from a matrix for connection. The matrix encloses the stair-stacked memory module and at least a portion of the processor die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.