Li Deng
6Patents
1h-index
9Co-inventors
40Inventor score
Filing activity: Dec 27, 2007 → Sep 3, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10770434B2 | Stair-stacked dice device in a system in package, and methods of making same | Electricity | 2 | Active |
| US10727208B2 | Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same | Electricity | 1 | Active |
| US11538746B2 | Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same | Electricity | 0 | Active |
| US7587976B2 | Printing apparatus having fixing mechanism including air pipe assembly | Performing Operations; Transporting | 0 | Active |
| US10991679B2 | Stair-stacked dice device in a system in package, and methods of making same | Electricity | 0 | Active |
| US10930622B2 | Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.