Polishing apparatus using neural network for monitoring
US10994389B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2018 |
| Grant date | May 4, 2021 |
| Priority date | — |
| Expiry date | May 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of polishing a layer on the substrate at a polishing station includes the actions of monitoring the layer during polishing at the polishing station with an in-situ monitoring system to generate a plurality of measured signals for a plurality of different locations on the layer; generating, for each location of the plurality of different locations, an estimated measure of thickness of the location, the generating including processing the plurality of measured signals through a neural network; and at least one of detecting a polishing endpoint or modifying a polishing parameter based on each estimated measure of thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.