Patent · US Active

Chip assembly and method of manufacturing thereof

US11004823B2 · kind B2 · utility

0Cited by

1References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Alexander Heinrich · Bad Abbach, DE
Frank Daeche · Unterhaching, DE

Key dates

Filing date	Jul 26, 2019
Grant date	May 11, 2021
Priority date	—
Expiry date	Jul 26, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15153
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip assembly includes a carrier and a metal grid array having an opening. The metal grid array is attached to the carrier by an attachment material. The metal grid array and the carrier define a cavity which is formed by the opening and the carrier. The chip assembly further includes an electronic chip mounted in the cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.