Substrates and methods of using those substrates
US11016401B2 · kind B2 · utility
0Cited by
3References
21Claims
0Family size
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Key dates
| Filing date | May 1, 2018 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | May 1, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/7095
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of dislodging contamination from a part of an apparatus used in a patterning process, the method including: providing a cleaning substrate into contact with the part of the apparatus while the part is attached to the apparatus, the cleaning substrate comprising a material configured to chemically react with the contamination; and dislodging contamination on the part of the apparatus by chemical reaction between the material and the contamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.