Thermocompression bond tips and related apparatus and methods
US11024595B2 · kind B2 · utility
0Cited by
13References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2017 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Jun 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bond tip for thermocompression bonding a bottom surface includes a die contact area and a low surface energy material covering at least a portion of the bottom surface. The low surface energy material may cover substantially all of the bottom surface, or only a peripheral portion surrounding the die contact area. The die contact area may be recessed with respect to the peripheral portion a depth at least as great as a thickness of a semiconductor die to be received in the recessed die contact area. A method of thermocompression bonding is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.