Level sensor apparatus, method of measuring topographical variation across a substrate, method of measuring variation of a physical parameter related to a lithographic process, and lithographic apparatus
US11029614B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2017 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Jul 21, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45031
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method of determining topographical variation across a substrate on which one or more patterns have been applied. The method includes obtaining measured topography data representing a topographical variation across a substrate on which one or more patterns have been applied by a lithographic process; and combining the measured topography data with knowledge relating to intra-die topology to obtain derived topography data having a resolution greater than the resolution of the measured topography data. Also disclosed is a corresponding level sensor apparatus and lithographic apparatus having such a level sensor apparatus, and a more general method of determining variation of a physical parameter from first measurement data of variation of the physical parameter across the substrate and intra-die measurement data of higher resolution than the first measurement data and combining these.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.